US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Sept. 30 for "Circuit board structure with embedded ceramic substrate and manufacturing process thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,852, issued on Sept. 30, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Circuit board structure with embedded ceramic substrate and manufacturing process thereof" was invented by Yu-Hsien Liao (Taipei, Taiwan), Shih-Han Wu (Taipei, Taiwan), Jhih-Wei Lai (Taipei, Taiwan), Jian-Yu Shih (Taipei, Taiwan) and Ming-Yen Pan (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure is related to a circuit board structure with an embedded ceramic substrate. A circuit substrate includes an insulating base, a first copper foil and a through-hole portion. A ceramic substrate is disposed in the through-hole portion...