US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 25 for "Intelligent power module package structure and hybrid ceramic board" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,737, issued on Nov. 25, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Intelligent power module package structure and hybrid ceramic board" was invented by Chia-Shuai Chang (Hsin-Chu County, Taiwan), Shu-Yi Liang (Taipei, Taiwan) and Yan-Wei Chen (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An intelligent power module (IPM) package structure and a hybrid ceramic board are provided. The hybrid ceramic board includes an insulating ceramic layer, a conductive layer connected to the insulating ceramic layer, and a direct-plated copper (DPC) ceramic substrate that is fixed onto the insulating ceramic layer. The...