ALEXANDRIA, Va., March 19 -- United States Patent no. 12,256,573, issued on March 18, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).
"Sensor package structure" was invented by Chia-Shuai Chang (Hsin-Chu County, Taiwan), Chien-Hung Lin (Taipei, Taiwan), Wen-Fu Yu (Taipei, Taiwan), Wei-Li Wang (Taipei, Taiwan), Bae-Yinn Hwang (Taipei, Taiwan) and Jyun-Huei Jiang (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encaps...