ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,399, issued on July 29, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).
"Sensor package structure" was invented by Chia-Shuai Chang (Hsin-Chu County, Taiwan), Chien-Chen Lee (Hsin-Chu County, Taiwan), Chien-Yuan Wang (Hsin-Chu County, Taiwan), Yi-Chih Lee (Hsin-Chu County, Taiwan) and Li-Chun Hung (Hsin-Chu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer disposed on the light-curing layer, a shielding layer being ring-shaped and disposed on an inner s...