US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Jan. 27 for "Chip package structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,598, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Chip package structure and method for fabricating the same" was invented by Dong-Ru Wu (Hsin-Chu County, Taiwan), Chien-Chen Lee (Hsin-Chu County, Taiwan) and Li-Chun Hung (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a chip, a molding layer and a package cover. The conductive substrate has first and second board surfaces opposite to each other, and a die-bonding region is defined on the first ...