US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Feb. 11 for "Sensor package structure having solder mask frame" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 12 -- United States Patent no. 12,224,359, issued on Feb. 11, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Sensor package structure having solder mask frame" was invented by Fu-Chou Liu (Hsin-Chu County, Taiwan), Jui-Hung Hsu (Hsin-Chu County, Taiwan), Yu-Chiang Peng (Hsin-Chu County, Taiwan), Chien-Chen Lee (Hsin-Chu County, Taiwan), Ya-Han Chang (Hsin-Chu County, Taiwan) and Li-Chun Hung (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder...