US Patent Issued to TOMOEGAWA on Feb. 4 for "Electrostatic chuck device and sleeve for electrostatic chuck device" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,217,994, issued on Feb. 4, was assigned to TOMOEGAWA Corp. (Tokyo).

"Electrostatic chuck device and sleeve for electrostatic chuck device" was invented by Nobuyoshi Yamazaki (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck device containing a substrate, a stack stacked on an upper surface of the substrate in the thickness direction, and a ceramic layer stacked on an upper surface of the stack in the thickness direction. A sleeve formed from an insulating material is inserted into a through-hole that penetrates through the substrate and the stack in the thickness direction. The upper surface of the sleeve in the thick...