ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,507, issued on Oct. 21, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).
"Wafer back surface cleaning device" was invented by Junichi Fukushima (Hachioji, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer back surface cleaning device preventing foreign matter from re-adhering to a wafer during and after cleaning. A hand H1 receives a wafer that has been cleaned at a cleaning position and conveys the wafer to a subsequent process, a hand H2 conveys the wafer before grinding to the cleaning position and transfers the wafer that has been cleaned to hand H1 with a front surface of the wafer directed upward. A cleaning pad and a cleaning water...