US Patent Issued to TOKYO SEIMITSU on Nov. 18 for "Alignment method, shape measuring method and shape measuring apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,164, issued on Nov. 18, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).

"Alignment method, shape measuring method and shape measuring apparatus" was invented by Tasuku Shimizu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The alignment method includes detecting an extending direction of a groove formed on a wafer, based on an image of the wafer picked up by a camera, and performing alignment so as to adjust the extending direction of the groove to be parallel to an array direction of pixels of the camera by relatively rotating the wafer and the camera."

The patent was filed on Aug. 9, 2023, under Application No. 18/446,534.

*For further i...