US Patent Issued to TOKYO SEIMITSU on July 29 for "Shape measurement device and method for controlling same" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,373,974, issued on July 29, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).

"Shape measurement device and method for controlling same" was invented by Hikaru Masuta (Tsuchiura, Japan) and Hideki Morii (Tsuchiura, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shape measurement device includes: a displacement detector configured to detect displacement of a contact; a relative movement mechanism configured to relatively move the displacement detector with respect to the measurement object, and allow the contact to trace a surface to be measured of the measurement object; a position detecting sensor configured to detect a relative position of the ...