US Patent Issued to Tokyo Seimitsu on Aug. 12 for "Wafer chuck, temperature control system, and temperature control method" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,966, issued on Aug. 12, was assigned to Tokyo Seimitsu Co. Ltd. (Tokyo).

"Wafer chuck, temperature control system, and temperature control method" was invented by Takenori Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer chuck having a holding surface for holding a wafer, the wafer chuck includes: a heating and cooling unit configured to heat or cool the wafer chuck; at least one temperature sensor disposed in the wafer chuck; and a heat flow sensor which is disposed in the wafer chuck, and in which a plurality of thermocouples are connected in series and connecting parts between thermocouples adjacent to each other are altern...