US Patent Issued to TOKYO SEIMITSU on April 22 for "Wafer test system, probe card replacing method, and prober" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,282,061, issued on April 22, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).

"Wafer test system, probe card replacing method, and prober" was invented by Akira Yamaguchi (Tokyo), Yuta Sato (Tokyo), Naoki Kasai (Tokyo), Naoyuki Yamazoe (Tokyo), Tetsuya Yasunaka (Tokyo), Kazuma Takii (Tokyo), Teppei Aoki (Tokyo), Wataru Kawasaki (Tokyo), Hiroki Ishida (Tokyo) and Yasuhito Iguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The wafer test system includes: a prober including a chuck that holds a semiconductor wafer and a probe card having probe needles thereon, and brings the probe needles in contact with semiconductor chips formed on the semicondu...