ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,663, issued on Jan. 20, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).
"Workpiece processing apparatus" was invented by Masaki Kanazawa (Hachioji, Japan), Hitoshi Aoki (Hachioji, Japan) and Kiyotaka Kizaki (Hachioji, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A workpiece processing apparatus that prevents a processing capability of a processing apparatus from deteriorating due to a peeling unit that peels a protective sheet from a workpiece. A workpiece processing apparatus includes an affixing unit that affixes a dicing tape to a workpiece and a dicing frame, and a plurality of peeling units that peel a protective sheet previously affix...