US Patent Issued to TOKYO OHKA KOGYO on Nov. 25 for "Etchant" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,048, issued on Nov. 25, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Etchant" was invented by Ming-Yen Chung (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An etchant for selectively removing, from a semiconductor substrate, a tungsten-containing hard mask having compatibility with silicon germanium (SiGe) or silicon phosphorus (SiP), the etchant including an organic solvent, a sulfur-containing salt, and an oxidant."

The patent was filed on May 5, 2023, under Application No. 18/313,122.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO...