US Patent Issued to TOKYO ELECTRONIC on April 15 for "Substrate processing apparatus and method for determining deterioration degree of conductive pipe" (Japanese Inventor)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,275,030, issued on April 15, was assigned to TOKYO ELECTRONIC Ltd. (Tokyo).

"Substrate processing apparatus and method for determining deterioration degree of conductive pipe" was invented by Tadashi Iino (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a substrate holder that holds and processes a substrate; a nozzle that ejects a processing liquid to the substrate held by the substrate holder; a conductive pipe connected to the nozzle and configured to supply the processing liquid to the nozzle; a processing liquid supply that supplies the processing liquid to the nozzle via the conductive pipe;...