US Patent Issued to Tokyo Electron on Sept. 9 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,470, issued on Sept. 9, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Teruhiko Kodama (Kumamoto, Japan), Koichi Matsunaga (Kumamoto, Japan) and Hideaki Iwasaka (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus that forms a friction reducing film on a rear surface of a substrate includes a processing container configured to accommodate the substrate and to define a hermetically-sealed processing space, a heating element configured to heat the rear surface of the substrate inside the processing container, a supplier configure...