US Patent Issued to Tokyo Electron on Sept. 30 for "Substrate processing method and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,392, issued on Sept. 30, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Yasutaka Mizomoto (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes preparing a stacked substrate including a first substrate divided into multiple chips, a protective film divided for each of the multiple chips to protect the chip, a second substrate supporting the first substrate, and an adhesive film configured to attach the protective film and the second substrate; reducing adhesive strength of the adhesive film with a light beam configured to ...