US Patent Issued to Tokyo Electron on Sept. 30 for "Heating device, substrate processing system, and heating method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,372, issued on Sept. 30, was assigned to Tokyo Electron Ltd. (Tokyo).

"Heating device, substrate processing system, and heating method" was invented by Takashi Sugimoto (Yamanashi, Japan), Hiroyuki Takahashi (Yamanashi, Japan) and Shinya Okano (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heating device for heating a substrate before the substrate is transferred to a processing device is provided. The heating device includes a support unit configured to support the substrate, and a heating unit including light emitting elements for emitting the light to individually heat divided regions of the substrate in plan view, the substr...