ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,721, issued on Sept. 30, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming apparatus and film forming method" was invented by Naoki Watanabe (Yamanashi, Japan) and Tatsuo Hatano (Yamanashi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming apparatus comprising: a processing container for accommodating a plurality of substrates, a substrate holder provided in the processing container and configured to hold the substrates such that the plurality of substrates are arranged along a circumferential direction; a rotating and revolving mechanism configured to rotate the plurality of substrates on the substrate holder and revolve...