ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,420,307, issued on Sept. 23, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing system" was invented by Takahito Nakashoya (Hillsboro, Ore.) and Takayuki Matsukawa (Hillsboro, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes processing a first surface of a substrate by a chemical liquid supplied to the first surface from a chemical liquid supply; and heating the substrate by starting a supply of a heated fluid to a second surface of the substrate prior to a start of a supply of the chemical liquid to the first surface of the substrate. A temperature of at least on...