ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,990, issued on Sept. 16, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate treatment method and substrate treatment system" was invented by Tsutomu Tsutsui (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment method treats a substrate. The method includes the steps of: (A) heating the substrate having a coating film formed on a surface thereof by supply of a coating solution; (B), after the (A) step, moving a discharge destination of a removing solution from a peripheral position on the surface of the substrate toward a center side of the substrate and turning it back at a first position to return it again to the...