US Patent Issued to Tokyo Electron on Sept. 16 for "Substrate processing apparatus and substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,230, issued on Sept. 16, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Hirotoshi Mori (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes an imaging device configured to image a first substrate held by a holder; a modifying device configured to form a modification layer by radiating laser light to an inside of the first substrate held by the holder along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof; a first moving device configured to move the holde...