ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,925, issued on Sept. 16, was assigned to Tokyo Electron Ltd. (Tokyo).
"Method of conductive material deposition" was invented by Hirokazu Aizawa (Albany, N.Y.), Kai-Hung Yu (Albany, N.Y.), Nicholas Joy (Albany, N.Y.), Yusuke Yoshida (Albany, N.Y.) and Kandabara Tapily (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing a substrate that includes: depositing a filling material over the substrate including a first recess and a second recess, the filling material filling the first recess and the second recess; patterning the filling material such that the first recess is reopened while the second recess remains filled w...