ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,976, issued on Oct. 7, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus" was invented by Masato Shinada (Fuchu, Japan) and Einstein Noel Abarra (Fuchu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a processing container; a temperature adjustment structure including a flow path inside a sidewall of the processing container; a shield member installed in the processing container so as to be adjacent to the flow path; a conductive member installed between the shield member and the sidewall in which the flow path is located; a buffer member having conductivity and interposed be...