US Patent Issued to Tokyo Electron on Oct. 7 for "Substrate placing method and substrate placing mechanism" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,033, issued on Oct. 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate placing method and substrate placing mechanism" was invented by Koichi Nakajima (Yamanashi, Japan), Kentaro Asakura (Yamanashi, Japan) and Yasuyuki Kagaya (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is a substrate placing method for placing a substrate on a placing surface of a placing table in a chamber of a substrate processing apparatus for processing a substrate, the placing table having the placing surface on which a substrate is placed and a tapered surface for guiding the substrate disposed at an outer periphery of the placing surface, the...