US Patent Issued to Tokyo Electron on Oct. 7 for "Substrate liquid processing apparatus and substrate liquid processing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,435,426, issued on Oct. 7, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate liquid processing apparatus and substrate liquid processing method" was invented by Mitsuaki Iwashita (Nirasaki, Japan) and Takeshi Nagao (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique advantageous for shortening time required for electroless plating that is performed on a substrate is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold the substrate; a reaction acceleration unit, configured to accelerate a plating reaction of an unused electroless plating solution, including an activation unit confi...