ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,326, issued on Oct. 21, was assigned to Tokyo Electron Ltd. (Tokyo).
"Plasma processing apparatus and plasma processing method" was invented by Taro Ikeda (Nirasaki, Japan), Satoru Kawakami (Nirasaki, Japan) and Masaki Hirayama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a plasma processing apparatus and a plasma processing method, improvement of the in-plane uniformity of plasma on a stage is required. The plasma processing apparatus includes a processing container, a stage, and a dielectric plate. The stage is provided within the processing container, the dielectric plate includes a plurality of through-holes for gas injection, and an...