US Patent Issued to Tokyo Electron on Oct. 21 for "Bonding system and inspection method of inspecting combined substrate" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,374, issued on Oct. 21, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding system and inspection method of inspecting combined substrate" was invented by Yoshitaka Otsuka (Koshi, Japan), Shigeto Tsuruta (Koshi, Japan), Yuji Mimura (Koshi, Japan), Hiroshi Maeda (Koshi, Japan), Eiji Manabe (Koshi, Japan), Hisanori Hizume (Sapporo, Japan), Shinichi Shinozuka (Koshi, Japan) and Hironori Tanoue (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The ...