US Patent Issued to Tokyo Electron on Oct. 14 for "Substrate support and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,635, issued on Oct. 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate support and substrate processing apparatus" was invented by Hideto Saito (Miyagi, Japan), Makoto Kato (Miyagi, Japan), Shin Yamaguchi (Miyagi, Japan), Takashi Kanazawa (Miyagi, Japan) and Ryoma Muto (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate support includes an electrostatic chuck formed of ceramics and holding a substrate by electrostatic attraction, a base supporting the electrostatic chuck, and a flow path through which a heat exchange medium flows. An upper surface of the flow path is formed of ceramics."

The patent was filed on June 2...