US Patent Issued to Tokyo Electron on Oct. 14 for "Substrate processing system and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,622, issued on Oct. 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system and substrate processing method" was invented by Keita Hirase (Kumamoto, Japan), Koji Tanaka (Kumamoto, Japan), Yukiyoshi Saito (Kumamoto, Japan) and Keisuke Sasaki (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes: a carry-in/out section in which a cassette accommodating a plurality of substrates is carried in/out; a batch processing section in which a wafer lot including the plurality of substrates is collectively processed; a single-wafer processing section in which the substrates of the wafer lot ...