US Patent Issued to Tokyo Electron on Oct. 14 for "Electrostatic attraction method and plasma processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,583, issued on Oct. 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Electrostatic attraction method and plasma processing apparatus" was invented by Masashi Ikegami (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic attraction method is provided. In the electrostatic attraction method, voltages are applied to one or more electrodes disposed in a substrate support while reversing the polarities of the voltages for each process cycle for plasma treatment. The one or more electrodes are disposed in the substrate support at at least a position corresponding to a ring member placed on the substrate support to surround a subs...