US Patent Issued to Tokyo Electron on Nov. 4 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,064, issued on Nov. 4, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Kouzou Tachibana (Koshi, Japan), Katsuhiro Morikawa (Koshi, Japan), Kouichi Mizunaga (Koshi, Japan), Masami Akimoto (Koshi, Japan) and Kousuke Negishi (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method of performing liquid processing on a substrate in a substrate processing apparatus, which includes a substrate table configured to suction the substrate, a heater configured to heat the substrate table, and a processing liquid nozzle configured to supply a processing...