US Patent Issued to Tokyo Electron on Nov. 4 for "Substrate processing apparatus and maintenance method for substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,021, issued on Nov. 4, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and maintenance method for substrate processing apparatus" was invented by Hiroki Endo (Miyagi, Japan), Nozomu Nagashima (Miyagi, Japan), Suguru Sato (Miyagi, Japan), Koei Ito (Miyagi, Japan), Taisei Seguchi (Miyagi, Japan) and Dai Kitagawa (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is a substrate processing apparatus comprising: a chamber including a sidewall having an opening; a substrate support disposed in the chamber; a support member disposed above the substrate support; an inner wall member having a ceiling portion dispo...