ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,070, issued on Nov. 25, was assigned to Tokyo Electron Ltd. (Tokyo).
"Wafer chuck with tunable stiffness material" was invented by Nathan Ip (Austin, Texas) and Nima Nejadsadeghi (Dallas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer bonding apparatus including: a first chuck in a processing chamber, the first chuck being configured to hold a first wafer, the first chuck including: a chuck body, and a tunable stiffness layer including a plurality of actuators, the plurality of actuators including a tunable stiffness material, the tunable stiffness layer being disposed below the chuck body; a controller configured to send control signals to o...