US Patent Issued to Tokyo Electron on Nov. 25 for "Substrate treatment method and substrate treatment device" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,695, issued on Nov. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate treatment method and substrate treatment device" was invented by Yuichiro Wagatsuma (Nirasaki, Japan), Masahisa Watanabe (Nirasaki, Japan) and Mayuko Nakamura (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate treatment method of a substrate treatment device, which includes a stage on which a substrate is mounted, a heating element provided on the stage, and a rotation mechanism that rotates the stage, includes: mounting the substrate on the stage; and performing a process on the substrate, wherein the performing the process on the substrate has ...