US Patent Issued to Tokyo Electron on Nov. 25 for "Substrate processing method and substrate processing apparatus" (Japanese, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,651, issued on Nov. 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Kae Kumagai (Miyagi, Japan), Toru Hisamatsu (Hillsboro, Ore.) and Masanobu Honda (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for processing a substrate includes: a chamber having a gas inlet and a gas outlet; a substrate support disposed in the chamber; a plasma generator; and a controller programmed to: (a) place a substrate on the substrate support, the substrate having a pattern, (b) supply a first reactive species into the chamber to adsorb the first reactive species ...