ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,480,884, issued on Nov. 25, was assigned to Tokyo Electron Ltd. (Tokyo).
"Analysis apparatus, bonding system, and analysis method" was invented by Yuji Mimura (Albany, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An analysis apparatus according to an aspect of the present disclosure includes a substrate holding unit, an insertion unit, and a gas analysis unit. The substrate holding unit holds a bonded substrate where a first substrate and a second substrate are bonded. The insertion unit is capable of being inserted between a bonding surface of the first substrate and a bonding surface of the second substrate in the bonded substrate that is held ...