US Patent Issued to Tokyo Electron on Nov. 18 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,686, issued on Nov. 18, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Takari Yamamoto (Miyagi, Japan), Noriiki Masuda (Miyagi, Japan), Kenichiro Nakamura (Miyagi, Japan) and Hiroshi Koizumi (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A temperature control method of controlling a temperature of a semiconductor wafer mounted on a mounting table includes a supply process of supplying, in a state that a supply of a power to a heater configured to heat the mounting table is stopped or the power is maintained to be constant, a heat transfer gas into a gap bet...