ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,125, issued on Nov. 18, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate inspection method and substrate inspection device" was invented by Isamu Taoda (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate inspection method includes: capturing, while transporting a substrate with a fork, an image of a rear surface of the substrate using a line camera in which light receiving elements are arranged in a width direction orthogonal to a transport direction of the substrate; generating a corrected image by correcting the image captured in the capturing the image based on locus information of the fork when the substrate is bei...