US Patent Issued to Tokyo Electron on Nov. 11 for "Surface modifying apparatus and bonding strength determination method" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,685, issued on Nov. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Surface modifying apparatus and bonding strength determination method" was invented by Takashi Terada (Koshi, Japan), Yuji Mimura (Koshi, Japan), Hiroshi Maeda (Koshi, Japan), Takuro Masuzumi (Koshi, Japan), Masaru Honda (Koshi, Japan) and Ryoichi Sakamoto (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate by plasma of a processing gas. The surface modifying apparatus includes a processing vessel; a measuring unit; and a controller. The processing vess...