ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,696, issued on Nov. 11, was assigned to Tokyo Electron Ltd. (Tokyo).
"Method of forming 3-dimensional spacer" was invented by Robert D. Clark (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate that includes: loading the substrate having a raised feature with at least two sidewalls exposed in a processing chamber; depositing a first layer over the substrate to cover a first portion of the two sidewalls; depositing a second layer over the first layer to cover a second portion of the two sidewalls; depositing a third layer over the second layer and the raised feature to cover a third portion of the sidewa...