US Patent Issued to Tokyo Electron on Nov. 11 for "Film thickness analysis method, film thickness analysis device and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,742, issued on Nov. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film thickness analysis method, film thickness analysis device and storage medium" was invented by Masahide Tadokoro (Kumamoto, Japan) and Toyohisa Tsuruda (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film thickness analysis method includes: acquiring film thickness values at a plurality of measurement points different from each other along a radial direction for a target film formed on an analysis target substrate by supplying a processing liquid while rotating the target substrate based on predetermined liquid processing conditions; and creating an approxima...