US Patent Issued to Tokyo Electron on Nov. 11 for "Decompression processing method for substrate processing apparatus and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,684, issued on Nov. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Decompression processing method for substrate processing apparatus and substrate processing apparatus" was invented by Wataru Shimizu (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a decompression processing method for a substrate processing apparatus including a chamber for processing a substrate in an inside thereof, a decompression unit that decompresses the inside of the chamber, and a gas supply that supplies a gas into the inside of the chamber, the method including supplying an additional substance mixable with moisture in a liquid or solid ...