US Patent Issued to Tokyo Electron on Nov. 11 for "Correction method and substrate transfer apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,724, issued on Nov. 11, was assigned to Tokyo Electron Ltd. (Tokyo).

"Correction method and substrate transfer apparatus" was invented by Takehiro Shindo (Nirasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A correction method includes a placement operation of holding and moving, by a holder, a sensor-equipped substrate equipped with an inclination sensor provided thereon, to a temporary delivery position, and delivering the sensor-equipped substrate from the holder to the stage, an inclination detection operation of detecting, by the inclination sensor, an inclination of the sensor-equipped substrate delivered to the stage, and performin...