US Patent Issued to Tokyo Electron on May 20 for "Substrate processing system and method for installing edge ring" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,221, issued on May 20, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing system and method for installing edge ring" was invented by Takashi Aramaki (Miyagi, Japan), Lifu Li (Miyagi, Japan), Nobutaka Sasaki (Miyagi, Japan), Toshiki Akama (Miyagi, Japan), Shusei Kato (Miyagi, Japan), Gyeong min Park (Miyagi, Japan), Wataru Shimizu (Miyagi, Japan) and Ryota Koitabashi (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes a plasma processing apparatus, a decompression transferrer coupled to the plasma processing apparatus, and control circuitry that controls a transfer robot to load an edg...