US Patent Issued to Tokyo Electron on May 13 for "Substrate support and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,475, issued on May 13, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate support and substrate processing apparatus" was invented by Michishige Saito (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a substrate support comprising: a base; a first flow path that opens on a bottom surface of the base at a central portion of the base; a second flow path that surrounds the first flow path and opens on the bottom surface of the base; at least one third flow path communicating with the first flow path and arranged from the central portion toward an outer peripheral portion of the base; and at least one fourth flow path...