US Patent Issued to Tokyo Electron on May 13 for "Substrate processing control method, substrate processing apparatus and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,526, issued on May 13, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing control method, substrate processing apparatus and storage medium" was invented by Toyohisa Tsuruda (Koshi, Japan) and Yoshitaka Konishi (Sapporo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing control method in a substrate processing apparatus, includes: acquiring a data set for each substrate sequentially subjected to first and second processes at first and second levels, the data set including information specifying the first level at which the first process has been performed, information specifying the second level at which the...