US Patent Issued to Tokyo Electron on May 13 for "Substrate processing apparatus and substrate processing method having enhanced configuration of replenishing processing liquid" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,518, issued on May 13, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method having enhanced configuration of replenishing processing liquid" was invented by Kazuki Kosai (Koshi, Japan), Hideaki Udou (Koshi, Japan), Seiya Fujimoto (Koshi, Japan), Yudai Takanaga (Koshi, Japan), Takahito Nakashoya (Koshi, Japan), Shogo Fukui (Koshi, Japan), Atsushi Anamoto (Koshi, Japan) and So Osada (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a sub...