US Patent Issued to Tokyo Electron on May 13 for "Placement stage and substrate processing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,530, issued on May 13, was assigned to Tokyo Electron Ltd. (Tokyo).

"Placement stage and substrate processing apparatus" was invented by Daisuke Satake (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A placement stage includes: a wafer placement part having a placement surface and a first through hole; a base bonded to a rear surface of the wafer placement part by a first adhesive layer, and including a second through hole formed in the base, the second through hole communicating with the first through hole; a sleeve installed in the second through hole to be detachable from the base; and the sealing member installed between the rear s...