US Patent Issued to Tokyo Electron on March 25 for "Substrate processing with material modification and removal" (New York Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,054, issued on March 25, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing with material modification and removal" was invented by Ivo Otto IV (Albany, N.Y.) and Subhadeep Kal (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An etch and surface modification is performed in a plasma, in which ions have been removed so that radicals of the plasma form a modified surface of a layer of substrate. A gas chemistry is reacted with the modified surface to form a reacted modified surface, and the reacted modified surface is removed."

The patent was filed on Aug. 11, 2022, under Application No. 17/886,289.

*For further informat...